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H5N3011P
Silicon N Channel MOS FET High Speed Power Switching
REJ03G0385-0200 Rev.2.00 Aug.05.2004
Features
* Low on-resistance * Low leakage current * High speed switching
Outline
TO-3P
D
G
1. Gate 2. Drain (Flange) 3. Source
S
1
2
3
Absolute Maximum Ratings
(Ta = 25C)
Item Drain to Source voltage Gate to Source voltage Drain current Drain peak current Body-Drain diode reverse Drain current Body-Drain diode reverse Drain peak current Avalanche current Avalanche energy Channel dissipation Channel to case thermal impedance Channel temperature Storage temperature Notes: 1. PW 10 s, duty cycle 1% 2. Value at Tc = 25C 3. STch = 25C, Tch 150C Symbol VDSS VGSS ID ID (pulse)Note1 IDR IDR (pulse)Note1 IAPNote3 EARNote3 Pch Note2 ch-c Tch Tstg Ratings 300 30 88 176 88 176 30 54 150 0.833 150 -55 to +150 Unit V V A A A A A mJ W C/W C C
Rev.2.00, Aug.05.2004, page 1 of 6
H5N3011P
Electrical Characteristics
(Ta = 25C)
Item Drain to Source breakdown voltage Zero Gate voltage Drain current Gate to Source leak current Gate to Source cutoff voltage Forward transfer admittance Static Drain to Source on state resistance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total Gate charge Gate to Source charge Gate to Drain charge Body-Drain diode forward voltage Body-Drain diode reverse recovery time Body-Drain diode reverse recovery charge Notes: 4. Pulse test Symbol V(BR)DSS IDSS IGSS VGS(off) |yfs| RDS(on) Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd VDF trr Qrr Min 300 -- -- 3.0 33 -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- 56 0.042 5000 640 65 60 370 200 280 95 25 40 1.0 260 2.5 Max -- 1 0.1 4.5 -- 0.048 -- -- -- -- -- -- -- -- -- -- 1.5 -- -- Unit V A A V S pF pF pF ns ns ns ns nC nC nC V ns C Test conditions ID = 10 mA, VGS = 0 VDS = 300 V, VGS = 0 VGS = 30 V, VDS = 0 VDS = 10 V, ID = 1 mA ID = 44 A, VDS = 10 V Note4 ID = 44 A, VGS = 10 VNote4 VDS = 25 V VGS = 0 f = 1 MHz ID = 44 A VGS = 10 V RL = 3.4 Rg = 10 VDD = 240 V VGS = 10 V ID = 88 A IF = 88 A, VGS = 0 Note4 IF = 88 A, VGS = 0 diF/dt = 100 A/s
Rev.2.00, Aug.05.2004, page 2 of 6
H5N3011P
Main Characteristics
Power vs. Temperature Derating 200
Pch (W)
1000 300
ID (A)
Maximum Safe Operation Area
100 30 10
Operation in
150
1m
s
10
10 0 s s
Channel Dissipation
100
Drain Current
3 this area is 1 limited by RDS(on) 0.3 0.1 0.03 0.01 Ta = 25C 1 DC Operation (Tc = 25C)
PW = 10 ms (1shot)
50
0
50
100
150 Tc (C)
200
Case Temperature
100 300 1000 30 3 10 Drain to Source Voltage VDS (V) Typical Transfer Characteristics
Typical Output Characteristics 100 10 V 8V Pulse Test 6V 100
VDS = 10 V Pulse Test 80
ID (A) Drain Current
ID (A)
80
60 5.5 V
60
Drain Current
40
40
20
VGS = 5 V
20
Tc = 75C
25C -25C 10 8 VGS (V)
0
4 8 12 Drain to Source Voltage
20 16 VDS (V)
0
2 4 6 Gate to Source Voltage
Drain to Source Saturation Voltage vs. Gate to Source Voltage 8
Drain to Source Saturation Voltage VDS(on) (V) Drain to Source on State Resistance RDS(on) ()
Pulse Test
Static Drain to Source on State Resistance vs. Drain Current 0.1 VGS = 10 V, 15 V 0.05
6 ID = 88 A 4
0.02 0.01
0.005
2
44 A 20 A
0.002 0.001 1 3 Pulse Test 10 30 100 300 Drain Current ID (A) 1000
0
12 4 8 Gate to Source Voltage
16 20 VGS (V)
Rev.2.00, Aug.05.2004, page 3 of 6
H5N3011P
Static Drain to Source on State Resistance vs. Temperature 0.2 VGS = 10 V Pulse Test 0.16 ID = 88 A 44 A 0.08 20 A 0.04 0 -25 Forward Transfer Admittance vs. Drain Current
Forward Transfer Admittance |yfs| (S)
Static Drain to Source on State Resistance RDS(on) ()
100 30 10 3 1 0.3 0.1 0.1 75C 25C Tc = -25C
0.12
VDS = 10 V Pulse Test 0.3 1 3 10 ID (A) 30 100
0
25
50
75
100 125 150 Tc (C)
Case Temperature
Drain Current
1000
Reverse Recovery Time trr (ns)
Body-Drain Diode Reverse Recovery Time
100000 30000
Typical Capacitance vs. Drain to Source Voltage VGS = 0 f = 1 MHz Ciss
500
Capacitance C (pF)
200 100 50 20 10 5 2 1 0.1 di / dt = 100 A / s VGS = 0, Ta = 25C 0.3 1 3 10 30 100 Reverse Drain Current IDR (A) Dynamic Input Characteristics 400 16 VDD = 50 V 100 V 240 V VDS VGS
VGS (V)
10000 3000 1000 300 100 30 10
Coss
Crss
0
50 100 150 Drain to Source Voltage VDS (V) Switching Characteristics VGS = 10 V, VDD = 150 V PW = 5 s, duty < 1 % RG = 10
10000
VDS (V)
ID = 88 A 300 12
Switching Time t (ns)
Drain to Source Voltage
Gate to Source Voltage
1000
tf td(off)
tr
200
8
100
tf td(on) tr
100
VDD = 240 V 100 V 50 V 40 80 120 160
4
0
0 200
10 0.1
0.3
Gate Charge
Qg (nC)
1 3 Drain Current
10 30 ID (A)
100
Rev.2.00, Aug.05.2004, page 4 of 6
H5N3011P
Reverse Drain Current vs. Source to Drain Voltage 100
IDR (A) Gate to Source Cutoff Voltage VGS(off) (V)
Gate to Source Cutoff Voltage vs. Case Temperature 5 VDS = 10 V ID = 10 mA 1 mA
80 60 VGS = 0 V 40 10 V 5V Pulse Test 0 0.4 0.8 1.2 1.6 VSD (V) 2.0 Source to Drain Voltage
4
Reverse Drain Current
3 0.1 mA 2
20
1 0 -25
0
25
50
75
100 125 150 Tc (C)
Case Temperature
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance s (t)
3 Tc = 25C 1 D=1 0.5 0.3
0.2
0.1
0.1
0.05
ch - c(t) = s (t) * ch - c ch - c = 0.833C/W, Tc = 25C
PDM
D=
PW T
0.03
0.02 1 0.0
1s
PW T
h
p ot
uls
e
0.01 10
100
1m
10 m 100 m Pulse Width PW (s)
1
10
Switching Time Test Circuit Vin Monitor D.U.T. RL 10 Vin 10 V V DD = 150 V Vin Vout 10% 10% Vout Monitor
Waveform
90%
10% 90% td(off) tf
90% td(on) tr
Rev.2.00, Aug.05.2004, page 5 of 6
H5N3011P
Package Dimensions
As of January, 2003
5.0 0.3 15.6 0.3 1.0
3.2 0.2
4.8 0.2 1.5
Unit: mm
0.5
14.9 0.2
19.9 0.2
1.6 1.4 Max 2.0 2.8 18.0 0.5
1.0 0.2
2.0
0.6 0.2
3.6
0.9 1.0
5.45 0.5
5.45 0.5
Package Code JEDEC JEITA Mass (reference value) TO-3P -- Conforms 5.0 g
Ordering Information
Part Name H5N3011P-E Quantity 30 pcs Plastic magazine Shipping Container
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
Rev.2.00, Aug.05.2004, page 6 of 6
0.3
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
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